METHOD OF ASSEMBLING MOLD FOR INJECTION MOLDING AND DEVICE FOR LOCATING THE MOLD FOR INJECTION MOLDING,申请号JP19760082220-传众专利搜索

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发明名称	METHOD OF ASSEMBLING MOLD FOR INJECTION MOLDING AND DEVICE FOR LOCATING THE MOLD FOR INJECTION MOLDING
摘要
申请公布号	JPS537761(A)	申请公布日期	1978.01.24
申请号	JP19760082220	申请日期	1976.07.09
申请人	MITSUBISHI ELECTRIC CORP	发明人	MIZUNO TAKASHI
分类号	B29C45/00;B29B13/00;B29C33/00;B29C33/30;B29C33/32;B29C41/00;B29C45/17;B29C45/26;B29D30/00	主分类号	B29C45/00
代理机构		代理人
主权项
地址

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