| 摘要 |
The disclosed method for forming an epoxy adhesive-bonded joint between a plurality of substrates is particularly well suited to an assembly line operation. The method involves forming an intimate mixture of the two components of a two-part adhesive system under conditions such that substantial curing will not occur until heat and/or pressure are applied. The application of heat and/or pressure for a short period of time initiates the curing reaction which will continue to completion under substantially normal ambient conditions. The initial bond strength is sufficient to hold mated substrates together with the bond strength increasing even when the curing process is completed under normal ambient conditions. For example, substrates can be coated with an intimate mixture of a two-part system suitable for use in this invention, stored for a period of time, mated on an assembly line under cure initiation conditions, and allowed to cure at normal room temperature and atmospheric pressure. Generally, conventional epoxy resins known in the art will work in the disclosed invention. The active hydrogen-containing curing agents or coreactants used in the disclosed invention are primary-amine terminated polyamides having a ball and ring softening point of 60 DEG -200 DEG C.
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