| 摘要 |
A method of forming a composite bearing structure including a metallic substrate having a bearing material adherently bonded thereto is provided which comprises the steps of treating the surface of a metallic substrate to remove undesirable substances therefrom, applying a layer of metallic bonding material to at least a part of the treated surface of the substrate, covering at least a part of the bonding material with a layer of bearing material, heating the so-formed article to a temperature sufficient to activate both the bonding material and the bearing material, and densifying both the bearing material and the bonding material while causing the metallic substrate to be reduced in thickness to thereby cause the bearing material to become bonded to the bonding layer which, in turn, is bonded to the metallic substrate. |
