| 摘要 |
<p>PURPOSE:To cross two chip components in three dimensions, and to mount the two chip components onto a printed wiring board by thicknening the side lower than the resistor holding section of a terminal and forming a space, in which another chip component can be inserted, to the lower section of a resistor in a chip component, the terminal of which is fixed to a land on the printed wiring board through soldering. CONSTITUTION:In the terminal 2b of a chip component 1b and a resistor 5, the lower section of the terminal 2b is made thicker than a section holding the chip component 1b, and a space shown in height H in which another chip component can be arranged can be ensured between the chip component 1b and a printed wiring board. A pair of lands 3a oppositely faced to the terminals 2a of a chip component 1a and a pair of lands 3b oppositely faced to the terminals 2b of the chip component 1b are disposed in a crossed shape respectively. The chip component 1a is soldered to the lands 3a, and the chip component 1b is soldered to the lands 3b so that the chip component 1a is covered.</p> |
