WAFER PRODUCT AND PROCESS OF MANUFACTURE

摘要

A crisp, approximately circular wafer product is provided whereby the two surfaces of the wafer each has a pattern formed by ridges, the first surface having a pattern comprising at least two grid patterns superimposed on each other, one grid being at an angle of approximately 45 DEG to the other, the second surface having a single grid pattern, the pattern being at 45 DEG to the lower grid on the first surface.