发明名称 Method for automatic, continuous selective plating on a tape member
摘要 The present invention relates to a method to effect a selective plating automatically and continuously in order to make connecting elements such as connectors or contact elements such as relays. More particularly it relates to a method to conduct a selective plating automatically and continuously at least on one of the upper and lower surfaces of a metal strip member unfolded from a roll, wherein the metal strip is moved intermittently in one direction correspondingly with the intervals at which at least one cleaning nozzle, one vacuum nozzle and one plating nozzle are linearly arranged while it is kept pressed onto the tips of the nozzles.
申请公布号 US4069109(A) 申请公布日期 1978.01.17
申请号 US19760672512 申请日期 1976.03.31
申请人 ABEI, HIROKO 发明人 ABEI, HIROKO
分类号 C25D5/02;C25D5/08;(IPC1-7):C25D5/02;C25D5/34 主分类号 C25D5/02
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