| 摘要 |
PROBLEM TO BE SOLVED: To improve the processability and productivity of a ceramic green sheet. SOLUTION: A carrier film 11 is thermally treated at 70-200 deg.C for >=10 sec in order to prevent the thermal contraction of the carrier film in post processes. The carrier film 11 is subjected to a surface treatment so as to give a peeling strength of 20-350 gf/50 mm wide from the ceramic green sheet 12, and further controlled to a tensile strength of <=20 kgf/mm<2> in order to improve punchability. The method for producing a ceramic multi-layered circuit substrate comprises casting a ceramic green sheet 12 on the thermally treated carrier film 11, subjecting the cast ceramic green sheet 12 to a cutting process and a punching process without peeling the carrier film, printing and drying the ceramic green sheet 12 to form a via conductor 18 or a wiring pattern 19, peeling the carrier film 11 from the ceramic green sheets 12, laminating the ceramic green sheets, and subsequently sintering the laminate. |
