| 摘要 |
An array of closely spaced injection lasers is mounted upon a common substrate of grooved semiconductor or insulating material, with the active (hot) layers of the lasers as close as possible to the substrate. Individual grooves of relatively large cross-sectional area are formed in the portions of the substrate upon which the respective lasers are seated, each of these grooves underlying a respective one of the lasers, and each groove is filled with a material that has high thermal and electrical conductivity, thereby providing a massive beam lead which also serves to dissipate heat generated by the respective laser. The walls of the grooves are treated to provide electrical isolation between the beam leads, so that these leads can be used to establish individual switching connections to the active elements of the respective lasers. With this arrangement, individual lasers in the array can be independently switched on and off as needed during a multiple beam scan, and each laser has an individual heat sink for efficiently dissipating the heat that it generates.
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