Selectively filled adhesives for compliant, reworkable, and solder-free flip chip interconnection and encapsulation

摘要

An electrically conductive adhesive film having a pattern of microscopic elongate metal particles which extend from one surface to the other to provide an interconnection between confronting conductive metal pads abutting the surface. The particles have sharp ends to penetrate the oxide coating on the conductive metal pads of an electronic module when force is applied to press the module against the film.