| 摘要 |
Since, with increasing miniaturisation of the structures on printed-circuit boards, the width of the conductor tracks is approaching the conductor track height, ever higher demands are being placed on the testing of such printed-circuit boards. The presently existing disadvantages such as, for example, too low a height resolution, low processing speed or difficulty in manipulation are eliminated by means of the method according to the invention for testing in the microscopic and macroscopic range of a printed- conductor board, as well as of a corresponding arrangement. Testing in the microscopic range is performed in each case inside unchanging, displaceable evaluation windows (20) by calculating cross-sectional areas (18, 19) at each scanned point on the printed-circuit board. Macroscopic testing is performed by calculating specific simple geometrical magnitudes inside grid coordinate systems (16, 17), followed by comparison with a reference. The arrangement for executing the method consists of a laser scanner for triangulation, an evaluation unit (9) and at least one high-resolution, position- sensitive detector (8). …<IMAGE>… |
