EPOXY RESIN COMPOSITION FOR DIE ATTACHMENT

摘要

PURPOSE: An epoxy resin composition is provided to ensure considerably high resilient ability to prevent wire bonding failure at sticking process and other adhesiveness power and good workability of 'moderate' flexible epoxy resin between 'hard' and 'soft' modified epoxy resin. CONSTITUTION: The composition comprises 10-50 wt.% of epoxy resin; 50-90 wt.% of inorganic filler and 50-99.9 wt.% of Ag relative to total amount of the inorganic filler. The filler is at least one selected from 0.1-50 wt.% of CuO, Cu2O and their mixture in an amount of 5-25 wt.% based on total weight of the filler. The composition further includes curing agent, diluent, adhesion promoter and thixotropic agent. The composition has the elasticity of 2-4x10exp9(Pa) at 0 deg.C gradually decreasing to 7x10exp7 - 3x10exp6(Pa) when it exceeds more than 150 deg.C, the viscosity of 8,000-20,000 cps at 25 deg.C. The adhesion layer between a semiconductor chip comprising the composition and a lid frame plate shows the adhesion intensity of 100-170kgf/cm¬2.