| 发明名称 |
GLASSSSEALED TYPE SEMICONDUCTOR DEVICE |
| 摘要 |
<p>PURPOSE:To prepare a semiconductor device using the same sealing glass regardless of the numbers of laminated layers with the aid of a spacer whose thickness is dependant upon the doefficients of thermal expansion and thicknesses of a pellet and solder.</p> |
| 申请公布号 |
JPS53975(A) |
申请公布日期 |
1978.01.07 |
| 申请号 |
JP19760074320 |
申请日期 |
1976.06.25 |
| 申请人 |
|
发明人 |
|
| 分类号 |
H01L23/29;H01L23/31;H01L23/48;H01L25/07 |
主分类号 |
H01L23/29 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
