| 发明名称 |
SCRIBING METHOD OF SEMICONDUCTOR WAFER |
| 摘要 |
<p>PURPOSE:To obtain a stabilized quality element with reduced micro cracks by scribing Si wafer through laser beams irradiated through on the glass protection film.</p> |
| 申请公布号 |
JPS5371(A) |
申请公布日期 |
1978.01.05 |
| 申请号 |
JP19760074685 |
申请日期 |
1976.06.23 |
| 申请人 |
NIPPON ELECTRIC CO |
发明人 |
MURAKI YOSHIHIKO;KACHI MASAO |
| 分类号 |
H01L21/301;H01L21/78 |
主分类号 |
H01L21/301 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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