| 摘要 |
The specification discloses a semiconductor device package which includes a conductive heat sink support member which is bonded to a planar face of a ceramic body. A conductive pattern is formed on a second planar face of the ceramic body and includes at least two discrete pattern portions. A semiconductor switching device has at least first and second terminals on one side and a third terminal on the other side. The semiconductor switching device is bonded on the one side to the conductive pattern, with the first and second terminals contacting the two discrete portions of the conductive pattern. First and second conductive leads are bonded to the two discrete portions of the conductive pattern adjacent to the semiconductor switching device and extend outwardly from the ceramic body. A third conductive lead is bonded to the third terminal on the other side of the semiconductor device. |
