发明名称 |
Method of bonding gold films to non-electrically conducting oxides and product thereby obtained |
摘要 |
A microstrip board comprising a gold film which contains about at least 1/2 weight per cent of aluminum bonded to a non-electrical conducting oxide is prepared by simultaneously evaporating the gold and aluminum onto the non-electrical conducting oxide and thereafter optionally heating the film thus formed.
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申请公布号 |
US4066819(A) |
申请公布日期 |
1978.01.03 |
申请号 |
US19710191292 |
申请日期 |
1971.10.21 |
申请人 |
THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY |
发明人 |
ANDERSON, WALLACE E.;SYELES, ALBERT M.;KRALL, ALBERT D. |
分类号 |
B32B15/04;H05K1/02;H05K1/09;(IPC1-7):B32B15/04 |
主分类号 |
B32B15/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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