METHOD FOR THE FORMATION OF CORROSION RESISTANT ELECTRONIC INTERCONNECTIONS

摘要

Disclosed is a method for the manufacture of composite thin films useful among other applications as electronic microcircuit interconnections, fuses, and contacts, terminal pads and voltage distribution ring metallurgy comprising in carrying out an integral circuit fabrication process the steps of first depositing a barrier layer of antidiffusion material, such as chromium, followed by superimposing thereon a film of highly conductive metals susceptible to corrosion and followed by the deposition of a highly corrosive resistant metal film. A subtractive etch pattern is formed in the composite metal film followed by heating the structure to an elevated temperature for a predetermined period of time so that the uppermost layer of the composite flows by diffusion over the edge section to protect the conductive metal film from corrosive effects.