RESIN SEALING METHOD OF SEMICONDUCTOR DEVICE,申请号JP19760073441-传众专利搜索

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发明名称	RESIN SEALING METHOD OF SEMICONDUCTOR DEVICE
摘要
申请公布号	JPS52156563(A)	申请公布日期	1977.12.27
申请号	JP19760073441	申请日期	1976.06.22
申请人	NIPPON ELECTRIC CO	发明人	HIRATA KOUICHI;KASUGA TOSHIO
分类号	H01L23/28;H01L23/08	主分类号	H01L23/28
代理机构		代理人
主权项
地址

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