| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad having grooves designed by properly computing the mutual rotation of a wafer and the polishing pad. <P>SOLUTION: The polishing pad useful for a chemical mechanical planarization has a polishing layer for planarizing a substrate. The polishing layer has a radius extending from a center of the polishing layer to an outer periphery of the polishing layer, one or more continuous grooves formed on the polishing layer and extending inward from the outer periphery of the polishing layer, and a circumference fraction grooved (CF). The CF takes place in the area extending a major distance from the outer periphery of the polishing layer to the center of the polishing layer, the CF is found by dividing a section of circumference across one or more continuous grooves out of circumferences at a given radius by the full circumference at the given radius. The CF remains within 25% of its average value as a function of the polishing layer radius. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
