Combined multilayer and single-layer capacitor for wirebonding

摘要

A substrate includes a single-layer capacitor and various external contacts. A first external contact provides a first electrical connection to the single-layer capacitor. A second external contact provides a second electrical connection to the single-layer capacitor. The first and third external contacts are electrically connectable to another electrical component, and internal metallization structures or vias of conductive material electrically connect the second contact and the third contact to facilitate the single-layer capacitor being connectable in a parallel circuit with the other electrical component.