发明名称 LIQUID-COOLING SYSTEM AND ELECTRONIC DEVICE
摘要 The invention relates to a liquid cooling system, comprising: a heat-receiving jacket(8) for receiving heat from a heat-generation body therein; a heat-radiator (9, 11) for radiating the heat therefrom, which is received within the heat-receiving jacket (8); and a tank (14) for accumulating refrigerant therein, which is connected with the heat-deceiving jacket (8) and the heat-radiators (9, 11) through flow passages (13), thereby enclosing a refrigerant within the heat-receiving jacket (8), the heat-radiator (9, 11) and the tank (14), including the flow passages (13) provided therebetween, and further comprising: a liquid transfer means (12) for generating a circulation flow of the refrigerant enclosed therein, wherein the tank(14) is built up on one side surface of a substrate (15) having superior heat-conductivity and heat-resistance, defined between a flexible film or sheet (16, 23) having superior heat-conductivity and heat-resistance, and the heat-radiator having a heat-radiation flow passage (9) on the other side surface thereof, defined between the flexible film or sheet (16, 23) having superior heat-conductivity and heat-resistance. <IMAGE>
申请公布号 KR100618482(B1) 申请公布日期 2006.08.31
申请号 KR20040114552 申请日期 2004.12.29
申请人 发明人
分类号 F25D1/00;G06F1/20;H01L23/473;H05K7/20 主分类号 F25D1/00
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