Connector for leadless integrated circuit packages

摘要

A connector for demountably attaching a leadless integrated circuit package to an electrically interconnecting backpanel includes a base receptacle mounted on the backpanel and having contact means therein which are in contact with the backpanel. The base receptacle is provided with upstanding headed studs and is adapted to receive the circuit package therein with the terminal pads of the package in alignment with the contact means of the base receptacle. A cover having apertured inclined planes formed therein is mounted atop the base receptacle so that lateral movement of the cover relative to the base causes interaction of the studs with the apertured inclined planes to load the terminal pads of the circuit package into conductive contact with the contact means of the base receptacle and to demountably lock the cover in place atop the base.