| 摘要 |
<p>An LED, an LED package and a manufacturing method thereof, and an electronic part and a manufacturing method thereof are provided to reduce the size of the electronic part and to improve the degree of integration by obtaining an aiming convex portion using a ceramic printing process and a sintering process. A paste type ceramic is printed on a surface of a ceramic substrate(4), wherein a firing process is performed on the ceramic substrate. A sintering process is performed on the paste type ceramic. At this time, a convex portion is formed on the surface of the ceramic substrate, so that an electronic part is completed.</p> |
