| 发明名称 |
POLISHING METHOD OF SEMICONDUCTOR WAFERS |
| 摘要 |
PURPOSE:To obtain a method of polishing semiconductor wafers without damaging their surfaces by covering the polishing surface with sealing wax then polishing the surface.
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| 申请公布号 |
JPS52151561(A) |
申请公布日期 |
1977.12.16 |
| 申请号 |
JP19760069186 |
申请日期 |
1976.06.11 |
| 申请人 |
SHARP KK |
发明人 |
MURATA KAZUHISA;HAYASHI HIROSHI;SAKURAI TAKESHI |
| 分类号 |
B28D5/00;H01L21/304 |
主分类号 |
B28D5/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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