| 摘要 |
A package for light emitting diode having a curved specular surface and a method for manufacturing the same are provided to obtain the desired distribution of luminance by adjusting a shape of the curved specular surface. A package for light emitting diode includes a base layer(110) on which a light emitting diode(50) is loaded, and a ring-shaped specular layer(120) surrounding the light emitting diode. An inner circumferential surface of the ring-shaped specular layer to be directed to a light emitting diode is formed with a curved surface. A metal material is coated on the inner circumferential surface of the ring-shaped specular layer. A method for manufacturing the package includes a process for forming a ceramic green sheet, a process for forming the base layer by cutting the ceramic green sheet, a process for forming the ring-shaped specular layer by cutting and punching the ceramic green sheet, a process for forming a curved surface of a zigzag shape on the inner circumferential surface of the ring-shaped specular layer by inserting the specular layer into a jig and pressing the specular layer, a process for attaching the ring-shaped specular layer to an upper surface of the base layer, and a process for baking the base layer and the ring-shaped specular layer.
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