| 发明名称 |
MANUFACTURE OF SEALING SUBSTANCE |
| 摘要 |
<p>PURPOSE:To obtain a sealing substance which has no leak at all from the sealing interface even though a sealing lead wire which has a heat expansion coefficient larger than the sealing glass may be used.</p> |
| 申请公布号 |
JPS52151554(A) |
申请公布日期 |
1977.12.16 |
| 申请号 |
JP19760067755 |
申请日期 |
1976.06.11 |
| 申请人 |
TOKYO SHIBAURA ELECTRIC CO |
发明人 |
KAWANISHI NORIO;YAMAGUCHI HISAO |
| 分类号 |
H01J5/46;H01K3/20 |
主分类号 |
H01J5/46 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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