摘要 |
<p>The fastener is intended for a heat generating semiconductor element, mounted on a heat sink. The amplifier in which the semiconductor element is to be mounted receives the element in a central threaded socket into which it is screwed at a given rotary angle position. This provides a connection with the heat sink via a thermal contact surface. To the heat sink (9) is connected, at least partly a locking strip (11), stamped out from the heat sink sheet. The strip is bent out of the heat sink plate and carries the threaded bore at right angles to the heat sink plane, for screwing down the semiconductor component (3). The latter abuts partly the unstamped edge (10) of the heat sink. The strip can be stressed at right angles to the heat sink plane by the semiconductor element screwing down.</p> |