发明名称 HEAT TREATING APPARATUS USING PLASMA JET
摘要 PURPOSE:To prevent plasma jet unevenness and to aim the uniform annealing by rotating water cooling nozzle as well as by providing the part, where anode point is formed, at the water cooling nozzle for anode in high speed annealing of wire material by plasma jet.
申请公布号 JPS52150709(A) 申请公布日期 1977.12.14
申请号 JP19760068276 申请日期 1976.06.10
申请人 MITSUBISHI ELECTRIC CORP 发明人 SHIMADA WATARU;HOSHINOUCHI SUSUMU
分类号 C21D9/56;C21D1/38 主分类号 C21D9/56
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