发明名称 Method and apparatus of measuring thin film sample and method and apparatus of fabricating thin film sample
摘要 In a method of measuring a thin film sample of irradiating an electron beam to a thin film sample, detecting a generated secondary electron and measuring a film thickness of the thin film sample by utilizing the secondary electron, it is provided that the film thickness is measured accurately, in a short period of time and easily even when a current amount of the irradiated electron beam is varied. An electron beam 2 b is irradiated, and a generated secondary electron 4 is detected by a secondary electron detector 6. A calculated value constituted by an amount of a secondary electron detected at a film thickness measuring region and an amount of a secondary electron detected at a reference region is calculated by first calculating means 11. A film thickness of the film thickness measuring region can be calculated from a calibration data of a standard thin film sample and the calculated value calculated by a sample 5.
申请公布号 US2008067384(A1) 申请公布日期 2008.03.20
申请号 US20070824994 申请日期 2007.07.02
申请人 SII NANO TECHNOLOGY INC. 发明人 IKKU YUTAKA;ASAHATA TATSUYA;SUZUKI HIDEKAZU
分类号 G21K7/00 主分类号 G21K7/00
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