| 发明名称 |
FORMATION OF HOLES IN SUBSTRATES USING DEWETTING COATINGS |
| 摘要 |
Methods and systems for forming holes in a substrate using dewetting coating are described herein.
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| 申请公布号 |
US2008070349(A1) |
申请公布日期 |
2008.03.20 |
| 申请号 |
US20060533653 |
申请日期 |
2006.09.20 |
| 申请人 |
MATAYABAS JAMES C;SUPRIYA LAKSHMI |
发明人 |
MATAYABAS JAMES C.;SUPRIYA LAKSHMI |
| 分类号 |
H01L21/00;H01L23/04 |
主分类号 |
H01L21/00 |
| 代理机构 |
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