发明名称 |
Method for manufacturing multi-layer printed circuit board |
摘要 |
The present invention relate to a method for manufacturing a multi-layer printed circuit board using inkjet printing and a vacuum printing equipment, in particular, a method for manufacturing a multi-layer printed circuit board including; preparing a board; forming wiring using inkjet printing on the board; forming an insulation layer using a thermosetting polymer compound on the board; forming via holes by a laser irradiation on the insulation layer; and filling metal nanoparticle paste in the via holes by a vacuum printing method.
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申请公布号 |
US2008070011(A1) |
申请公布日期 |
2008.03.20 |
申请号 |
US20070902237 |
申请日期 |
2007.09.20 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
OH SUNG-IL;JOUNG JAE-WOO;CHO SUNG-NAM |
分类号 |
C23C14/04;B05D3/06;B32B3/10 |
主分类号 |
C23C14/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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