| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing process of a semiconductor device in which dust particle is removed from a probe needle without using a sandpaper. SOLUTION: The manufacturing process of a semiconductor device comprises a step for forming an insulating film 10 on or above a semiconductor substrate 1, a step for forming a conductive pad 12a and a dummy conductive pad 12b on the insulating film 10, a step for forming a protective film 14 on the insulating film 10, the conductive pad 12a and the dummy conductive pad 12b, a step for forming a pad opening 14a and a dummy pad opening 14b in the protective film 14, a step for forming a probe needle polishing pattern 16a on the dummy conductive pad 12b, a step for inspecting the semiconductor device by pressing a probe needle 60 against the conductive pad 12a, and a step for removing a dust particle 60a adhering to the probe needle 60 against the probe needle polishing pattern 16a. COPYRIGHT: (C)2008,JPO&INPIT
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