发明名称 ASSEMBLING METHOD OF SEMICONDUCTOR DEVICES
摘要 <p>PURPOSE:To prevent damaging of electrodes by forming scribing grooves in pellets, then diluting and coating the synthetic resin which evaporates at a low temperature not hazardous to the pellets and bonding the pellets to leads through thermo-compression bonding.</p>
申请公布号 JPS52147061(A) 申请公布日期 1977.12.07
申请号 JP19760064867 申请日期 1976.06.01
申请人 发明人
分类号 H01L21/52;H01L21/301;H01L21/31;H01L21/58;H01L21/78 主分类号 H01L21/52
代理机构 代理人
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