发明名称 VALVE AND APPARATUS AND METHOD FOR TREATING SUBSTRATE WITH THE SAME
摘要 A valve and an apparatus and a method for treating a substrate with the valve are provided to facilitate the soft pumping and the gas flow control in respect with a vacuum line between the vacuum pump and the processing chamber. A valve(100) comprises a housing(110), a plate(120), a shaft(122), a piston(130), a pressure meter(140), an air supply line(150), a sensor(160), and a controller(170). The fluid passage is formed in the housing. The plate controls the aperture ratio of the fluid passage while moving with the piston. The plate is positioned at the lower portion of the driving space(b1,b2,b3). The shaft connects the plate and the piston. The piston moves up and down perpendicular to the fluid passage while being positioned in the upper side of the drive space. The pressure meter measures the internal pressure of vacuum line. The air supply line supplies the air to the drive space. The sensor is positioned at the side wall of the housing and senses the location of piston in the drive space. The valve is arranged between the substrate processing apparatus and the vacuum pump. The substrate processing apparatus processes the substrate through the valve. The vacuum pump can reduce the pressure in the processing chamber through the valve.
申请公布号 KR20090002639(A) 申请公布日期 2009.01.09
申请号 KR20070066152 申请日期 2007.07.02
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JUNG, JAE UK
分类号 H01L21/02 主分类号 H01L21/02
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