| 发明名称 |
CAPILLARY FOR BONDING SEMICONDUCTORS |
| 摘要 |
PURPOSE:To avoid clogging a capillary and thereby make a smooth bonding operation possible by jetting a fluid from the bonding portion of the capillary and its adjacent portion. |
| 申请公布号 |
JPS52144274(A) |
申请公布日期 |
1977.12.01 |
| 申请号 |
JP19760060606 |
申请日期 |
1976.05.27 |
| 申请人 |
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发明人 |
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| 分类号 |
B23K20/00;H01L21/60;H01L21/603 |
主分类号 |
B23K20/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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