COOLING AND PRESSURING EQUIPMENT ESP. FOR POWER SEMICONDUCTIVE ELEMENTS

摘要

An arrangement including a hydraulic chamber for simultaneously regulating the contact pressure on a plurality of heat sinks associated with planar semiconductor devices to be cooled is described. A corresponding plurality of elongated rods coupled at their outer ends to one surface of each of the heat sinks extend outwardly through aligned holes in a boundary wall of the chamber. A plunger or other suitable device extends into the chamber through a second opening therein to vary the pressure on the compressible medium and thereby to urge the heat sinks against the associated semiconductive elements with a uniform pressure. Facilities are provided for electrically deactivating the semiconductive elements when the pressure within the chamber falls below a predetermined value.