Strengthened glass substrates with glass frits and methods for making the same

摘要

Strengthened glass substrates with glass fits and methods for forming the same are disclosed. According to one embodiment, a method for forming a glass frit on a glass substrate may include providing a glass substrate comprising a compressive stress layer extending from a surface of the glass substrate into a thickness of the glass substrate, the compressive stress having a depth of layer DOL and an initial compressive stress CSi. A glass frit composition may be deposited on at least a portion of the surface of the glass substrate. Thereafter, the glass substrate and the glass frit composition are heated in a furnace to sinter the glass fit composition and bond the glass frit composition to the glass substrate, wherein, after heating, the glass substrate has a fired compressive stress CSf which is greater than or equal to 0.70*CSi.

主权项

1. A method for forming a glass frit on a glass substrate, the method comprising:
providing a glass substrate comprising a compressive stress layer extending from a surface of the glass substrate into a thickness of the glass substrate, the compressive stress layer having a depth of layer DOL and an initial compressive stress CSi, wherein the glass substrate is an ion-exchanged glass substrate comprising aluminosilicate or alkali borosilicate glass; depositing a lead free glass frit composition on at least a portion of the surface of the glass substrate to form a glass assembly; heating the entire glass assembly in a furnace to sinter the lead free glass frit composition and bond the lead free glass frit composition to the glass substrate, wherein, after heating, the lead free glass frit composition is fully vitrified and the glass substrate has a fired compressive stress CSf which is greater than or equal to 0.70*CSi, wherein the entire glass assembly is heated by: heating the glass assembly to a first temperature T1; holding the glass assembly at the first temperature T1 for a first holding time HT1; heating the glass assembly to a second temperature T2; and holding the glass assembly at the second temperature T2 for a second holding time HT2, wherein the second temperature T2 is less than or equal to about 450° C. and the first temperature T1 is less than or equal to the second temperature T2.