发明名称 Precision metering system for the delivery of abrasive lapping and polishing slurries
摘要 A system for supplying an abrasive-containing liquid to a lapping or polishing machine includes a supply of abrasive slurry concentrate containing abrasive grain which is suspended in a liquid, a supply of diluent liquid which is essentially free from solids, and a mixing chamber positioned relatively close to a desired work surface. The slurry concentrate and diluent are separately conveyed under pressure to the mixing chamber to develop a diluted slurry concentrate which is sufficiently diluted to permit settling out of the abrasive grain. The diluted slurry is then supplied to the work surface.
申请公布号 US4059929(A) 申请公布日期 1977.11.29
申请号 US19760684972 申请日期 1976.05.10
申请人 CHEMICAL-WAYS CORPORATION 发明人 BISHOP, DAVID C.
分类号 B24B57/00;(IPC1-7):B24B57/00 主分类号 B24B57/00
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