发明名称 |
Precision metering system for the delivery of abrasive lapping and polishing slurries |
摘要 |
A system for supplying an abrasive-containing liquid to a lapping or polishing machine includes a supply of abrasive slurry concentrate containing abrasive grain which is suspended in a liquid, a supply of diluent liquid which is essentially free from solids, and a mixing chamber positioned relatively close to a desired work surface. The slurry concentrate and diluent are separately conveyed under pressure to the mixing chamber to develop a diluted slurry concentrate which is sufficiently diluted to permit settling out of the abrasive grain. The diluted slurry is then supplied to the work surface.
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申请公布号 |
US4059929(A) |
申请公布日期 |
1977.11.29 |
申请号 |
US19760684972 |
申请日期 |
1976.05.10 |
申请人 |
CHEMICAL-WAYS CORPORATION |
发明人 |
BISHOP, DAVID C. |
分类号 |
B24B57/00;(IPC1-7):B24B57/00 |
主分类号 |
B24B57/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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