SENSITIZERS FOR ELECTROLESS METAL DEPOSITION

摘要

1420738 Electroless plating KOLLMORGEN CORP 15 July 1974 [1 Aug 1973] 31207/74 Heading C7F A sensitizing solution for use in the electroless deposition of e.g. Cu, Ni, Pd, Co, Ag, and Au comprises a reaction product formed by heating a mixture of A.D.E.G. where A is an ion of a precious metal selected from the 5th or 6th period of Groups VIII and IB, D is a metal ion of a Group IV metal capable of two valence states e.g. Sn, Ge or Ti, E is an anion capable of forming a stable soluble complex with A and D, and G is a hydroxyl group containing organic aromatic compound, e.g. resoreinol, catechol, hydroquinone, phloroglucinal, phenol, pyrogallol, anthraquinone or sulphonated phenol. The solution may be in water, methanol, ketones e.g. cyclohexanone or dibutyl ether. The substrate may be Fe-Ni, Co, Ag, Au, Cu or plastics. The solution may contain a wetting agent, e.g. perfluorodecanoic acid.