Signal monitoring of through-wafer vias using a multi-layer inductor

摘要

According to a method herein, a multi-level inductor is created around a through-silicon-via (TSV) in a semiconductor substrate. A voltage induced in the multi-level inductor by current flowing in the TSV is sensed, using a computerized device. The voltage is compared to a reference voltage, using the computerized device. An electrical signature of the TSV is determined based on the comparing the voltage to the reference voltage, using the computerized device.

主权项

1. A method of identifying failed components in an integrated circuit, comprising:
creating a multi-level coil inductor around a through-silicon-via (TSV) in a multi-layer semiconductor substrate, said TSV electrically connecting layers of said multi-layer semiconductor substrate, and said multi-level coil inductor comprising a coil having several turns around said TSV; passing an electrical current through said TSV; sensing a voltage induced in said multi-level coil inductor by said electrical current flowing in said TSV, using a computerized device; comparing said voltage to a reference voltage, using said computerized device; and identifying failure of said TSV based on said voltage not matching said reference voltage, using said computerized device.