| 摘要 |
The purpose of the present invention is to provide a method of producing a photomask which enables precise control over the amount of an optical layer to be removed, and a method of manufacturing a display device using the photomask. The method comprises the steps of: preparing a photomask substrate having a first resist layer and an optical layer applied on a transparent substrate; forming a first resist pattern; performing a first patterning process for etching and thereby removing the optical layer; peeling the first resist pattern and applying a second resist layer; forming a second resist pattern; performing a second resist patterning process for etching the optical layer; and peeling the second resist pattern, wherein minus sizing is performed on the second lithography pattern such that the section of the transparent substrate exposed by the second resist pattern is slightly smaller than the section of the transparent substrate exposed by the first resist pattern. |
