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发明名称
SEALING METHOD FOR SEMICONDUCTOR DEVICES
摘要
申请公布号
JPS52141174(A)
申请公布日期
1977.11.25
申请号
JP19760057268
申请日期
1976.05.20
申请人
HITACHI LTD
发明人
YOKOYAMA TAKASHI;MIYATERA YASUO;SUZUKI HIROSHI;KAMEI TATSUYA
分类号
H01L23/28;H01L23/16
主分类号
H01L23/28
代理机构
代理人
主权项
地址
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