Arrangement for an integrated circuit on a substrate - using thin and thick metal films sepd. by an insulating film

摘要

Assembly of a substrate for an electronic circuit comprises a substrate of insulating material; parts of a first thin metallic film formed on the substrate according to a predetermined pattern; a first thick metallic film applied on top of the thin metallic film; and insulating layer formed on top of the thick metal films on previously exposed areas; and parts of a second thin film followed by a second thick film on the same areas. The thin and thick films are respectively made of Ti and Ni. Alternatively, the thick metal films may be of Au or Rh. Used esp. for intergrated hybrid circuits. The substrate is less expensive and more robust than those of prior art. It permits assembly of a very compact hybrid circuit.