PREPARATION METHOD OF ELECTROMAGNETIC WAVE SHIELDING FILM FOR FLEXIBLE PRINTED CIRCUIT BOARD

摘要

The present invention relates to a method of preparing a film of shielding an electromagnetic wave for a flexible printed circuit board. According to the present invention, the invention includes the steps of: (i) forming an insulation layer by coating a thermosetting resin composition for forming an insulation layer on a first surface of a first base film; (ii) laminating a peelable double-layer copper foil comprising a second copper foil, an adhesive layer and a first carrier copper foil on the insulation layer, wherein the first carrier copper foil is detached after coupling the insulation layer and the second copper foil; (iii) forming a conductive adhesive layer by coating a resin composition comprising a conductive filler and a thermosetting resin for forming a conductive adhesive layer on a first surface of a second base film, and drying the same; and (iv) laminating the first base film and the second base film, wherein the second copper foil of the first base film and the conductive adhesive layer of the second base film are arranged so as to be adjoined and compressed through a pressurization process. The present invention can minimize the loss of source materials resulting from repetitively performing multiple coating processes so as to form a plurality of coating layers when the electromagnetic wave shielding film is conventionally manufactured, and can enhance economic feasibility by simplifying the manufacturing process.