发明名称 CONDUCTIVE COMPOSITION FOR THIN FILM PRINTING AND THIN FILM CONDUCTIVE PATTERN FORMATION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a conducive composition for thin film printing easy to thin film printing with thickness of 5 μm or less and capable of easily enhancing conductivity in a short time by heat burning at 300°C or less or a light irradiation.SOLUTION: There is provided a conductive composition for thin film printing containing a metal particle, a metal nano wire or a metal nano tube, a binder resin and a solvent, a ratio of the metal particle:the metal nano wire and/or the metal nano tube is 98:2 to 20:80, the total content of the metal particle and the metal nano wire and/or the metal nano tube is 15 to 60 mass%, the percentage content of the solvent is 30 to 85 mass%, the binder resin of 0.5 to 15 pts.mass is contained based on the total amount of 100 pts.mass of the metal particle and the metal nano wire and/or the metal nano tube and viscosity at 25°C is 1.0×10to 5×10mPa s.SELECTED DRAWING: None
申请公布号 JP2016121241(A) 申请公布日期 2016.07.07
申请号 JP20140260880 申请日期 2014.12.24
申请人 SHOWA DENKO KK 发明人 UCHIDA HIROSHI;NAKAZAWA ERI;HARA MASANAO
分类号 C09D11/52;C09D11/02;H01B1/00;H01B1/22;H01B13/00;H05K1/09;H05K3/12 主分类号 C09D11/52
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