| 发明名称 |
Method of forming viaducts in semiconductor material |
| 摘要 |
This method of forming viaducts or "through-holes" in semiconductor material for transistor and integrated circuit fabrication and especially for ink jet printing systems forms viaducts of uniform diameter without critical registration of masks.
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| 申请公布号 |
US4059480(A) |
申请公布日期 |
1977.11.22 |
| 申请号 |
US19760727831 |
申请日期 |
1976.09.29 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
RUH, WOLF-DIETER;TRIPPEL, GERHARD |
| 分类号 |
B41J2/135;B26F1/26;B41J2/16;C23F1/00;C23F1/02;D01D4/00;G03F1/16;G03F7/09;(IPC1-7):B23P15/00;B44C1/22 |
主分类号 |
B41J2/135 |
| 代理机构 |
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代理人 |
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| 主权项 |
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