Semiconductor device package and method of manufacturing the same

摘要

A semiconductor package includes a substrate, a set of electrical components, a stud, a tapering electrical interconnection and a package body. The electrical components are disposed on a top surface of the substrate. A bottom surface of the stud is disposed on the top surface of the substrate. A bottom surface of the electrical interconnection is disposed at a top surface of the stud. A width of the stud is greater than or equal to a width of the bottom surface of the electrical interconnection. The package body is disposed on the top surface of the substrate, and encapsulates the electrical components, the stud and a portion of the electrical interconnection. The package body exposes a top surface of the electrical interconnection.

主权项

1. A semiconductor device package, comprising:
a first substrate having a top surface; a first set of electrical components disposed on the top surface of the first substrate; at least one stud having a top surface and a bottom surface, the bottom surface of the stud disposed on the top surface of the first substrate; a tapering electrical interconnection having a top surface and a bottom surface, the bottom surface of the electrical interconnection being disposed at the top surface of the stud, a width of the stud is greater than or equal to a width of the bottom surface of the electrical interconnection; and a first package body disposed on the top surface of the first substrate, encapsulating the first set of electrical components, the stud and a portion of the electrical interconnection, the first package body exposing the top surface of the electrical interconnection.