| 发明名称 |
PRECISION PROCESS METHODE FOR SEMICONDUCTOR MATERIAL |
| 摘要 |
PURPOSE:To ensure a high-accuracy surface processing for the semiconductor parts parts with less flaws by use of a chemical solution and grindstone for the process of the semiconductor material.
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| 申请公布号 |
JPS52140265(A) |
申请公布日期 |
1977.11.22 |
| 申请号 |
JP19760056504 |
申请日期 |
1976.05.19 |
| 申请人 |
HITACHI LTD |
发明人 |
OCHIAI YUUJI;NAGAYAMA KAZUHIKO;ARAKAWA NORIYOSHI |
| 分类号 |
H01L21/304;H01L21/302 |
主分类号 |
H01L21/304 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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