METHOD FOR PREPARATION OF POLYIMIDE FILM USING POROUS PARTICLES AND POLYIMIDE FILM HAVING LOW PERMITTIVITY

摘要

The present invention relates to a method for producing a polyimide film using porous particles. The present invention further relates to a low dielectric constant polyimide film produced by the method. According to the present invention, the average particle diameter of the polyimide film is less than or equal to 10 μm, and the polyimide film includes porous particles showing true density of less than or equal to 95% with respect to true density of the particle itself, thereby creating lower dielectric constant than an existing polyimide film. Thus, the polyimide film can be useful for producing electric/electronic devices and components used in printed circuit boards requiring low dielectric constant.