| 摘要 |
The electrode comprises a lead, made of thermally and electrically conductive metal, brazed to an axially extending contact, made of molybdenum, using an Ag-Cu based brazing alloy having a wetting point of >=450 degrees C. The joint withstands higher temps. than soft soldered joints and has lower porosity, higher physical strength and better resistance to high temps. and high humidity than butt welded joints. The restrictions on dimensions of the contact or the lead required for butt welding are avoided so that the miniaturisation of the semiconductor device is not impeded. Pref. the lead is made of Cu, Ag or their alloys and the brazing alloy has the compsn. (by wt.) 80-89% Cu, 5-15% Ag and 4-6% P. |
