| 发明名称 |
HOUSING FOR A COMPRESSION BONDED ENCAPSULATION OF A SEMICONDUCTOR DEVICE |
| 摘要 |
<p>An assembly comprising a metal-semiconductor-metal element, an insulating sleeve member disposed about the metal-semiconductor-metal element and a metal pole piece contact. The three elements together form a disc-shaped power semiconductor device assembly for operation in a compression bonded application.</p> |
| 申请公布号 |
CA1021068(A) |
申请公布日期 |
1977.11.15 |
| 申请号 |
CA19750228703 |
申请日期 |
1975.06.06 |
| 申请人 |
WESTINGHOUSE ELECTRIC CORPORATION |
发明人 |
RICE, LESLIE R. |
| 分类号 |
H01L21/52;H01L23/04;H01L23/051;H01L23/48 |
主分类号 |
H01L21/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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